Features

1. CSR BC5MM-EXT Bluetooth v2.1+EDR
2. DSP Co-Processor 16-bit Internal Stereo CODEC - 95dB SNR for DAC
3. Support up to 16M Flash
4. USB and UART with Dual Port Bypass Mode up to 4Mbits/s
5. Size dimension: 19.8mm x 14.8mm x 1.8 mm
6. BT profile support : HFP, HSP, OPP, SPP, DUN, A2DP, AVRCP, PBAP, MAP, Phonebook download, SMS download, SMS Notification via GSM 07.07 AT commands, Phonebook download via SyncML, AEC/NS running in embedded DSP.

Features

1. BC 5 Bluetooth v 2.1 +EDR
2. DSP Co-Processor 16-bit Internal Stereo CODEC - 95dB SNR for DAC
3. Support up to 8M Flash
4. USB and UART with Dual Port Bypass Mode up to 4Mbits/s
5. Size dimension: 11mm x 13mm x 1.7mm
6. BT profile support : HFP, HSP, OPP, SPP, DUN, A2DP, AVRCP, PBAP, MAP, Phonebook download, SMS download, SMS Notification via GSM 07.07 AT commands, Phonebook download via SyncML, AEC/NS running in embedded DSP.

Features

1. CSR BC5MM-EXT Bluetooth v2.1+EDR
2. DSP Co-Processor 16-bit Internal Stereo CODEC - 95dB SNR for DAC
3. Support up to 16M Flash
4. USB and UART with Dual Port Bypass Mode up to 4Mbits/s
5. Size dimension: 19.8mm x 14.8mm x 1.8 mm
6. BT profile support : HFP, HSP, OPP, SPP, DUN, A2DP, AVRCP, PBAP, MAP, Phonebook download, SMS download, SMS Notification via GSM 07.07 AT commands, Phonebook download via SyncML, AEC/NS running in embedded DSP.

Features

1. Bluetooth Ver 4.0 + BLE + Ver2.1 + ED
2. Provide Host CPU interface through USB or UART interface
3. LGA package: size 10.5(L) x 10.5(W) x 2.0(H)mm with shielding case
4. Built on module Program Mask-ROM can provide SPP profile.
5. nFore provide SPP profile with Apps on Android or (iOS) smart phone

Features

1. Bluetooth v2.1 + EDR (2M & 3M bps modulation)system
2. Full Speed Bluetooth Operation with Full Piconet Support
3. Scatternet Support
4. Stamp package: 19.8mm(L) x 14.8mm(W) x 1.7mm(H)
5. Provide Host CPU interface through USB or UART interface
6. nFore provides SPP profile with Apps for Android or iOS platform.
7. Operating temperature range(-40℃ to +85℃)

Features

1. WLAN, Bluetooth and FM radio on a module
2. Application: Industrial / automotive / portable consumer products
3. Supporting IEEE 802.11 b/g/n (WLAN) and Bluetooth frequency band at 2.4 GHz
4. SDIO interface for Wi-Fi and UART interface for Bluetooth HCI
5. Integrated high-rejection filter for Coexistence between WLAN and Bluetooth radios. (bandwidth sharing)
6. Integrated high-isolation 2.4G antenna switch between WLAN and Bluetooth RF (antenna sharing)
7. Integrated high-output Efficient Power Amplifier and LNA.
8. Integrated low noise LDO for Bluetooth and WLAN voltage supply (3.3V/1.8V input)
9. FM RDS Receive and Transmit operation
10. Digital Radio Processor(DRP)
11. Embedded internal clocks.
12. Zero external components required
13. Seamless integration with TI OMAP application processor
14. LGA-60 package Dimension: 10mm x 10mm x 1.8mm
15. Operating Voltage : VBAT : 3.3 to 5.5V ; VIO: 1.62 to1.92V ;VDD: 1.7 to 1.95V
16. RoHS / REACH Compliant
17. Industrial Level
18. OS: Linux ,Android
19. BT profile support: SPP, HFP, HSP, OPP, DUN, A2DP, AVRCP, PBAP, MAP

Features

1. Application: industrial / automotive / portable consumer products
2. Supporting IEEE 802.11 b/g/n (WLAN) and Bluetooth frequency band at 2.4 GHz
3. SDIO interface for Wi-Fi and UART interface for Bluetooth HCI
4. Integrated high-rejection filter for Coexistence between WLAN and Bluetooth radios. (bandwidth sharing)
5. Integrated high-isolation 2.4G antenna switch between WLAN and Bluetooth RF (antenna sharing)
6. Integrated WLAN and Bluetooth Balun
7. Integrated high-output Efficient Power Amplifier and LNA.
8. Integrated low noise LDO for Bluetooth and WLAN voltage supply (3.3V input only)
9. Support dual voltage for SDIO and UART (1.8V/3.3V)
10. Embedded internal clocks.
11. Zero external components required
12. Stamp package dimension 17mm x 17mm x 1.7mm
13. Operating Voltage : 3.3V±10%
14. RoHS / REACH Compliant
15. Industrial Level
16. OS: Linux, Android & WinCE
17. BT profile support : SPP, HFP, HSP, OPP, DUN, A2DP, AVRCP, PBAP, MAP

Features

1. Fully Qualified Bluetooth® v2.1 + EDR Specification
2. Piconet and Scatternet Support
3. Low-Power 1.5V Operation, 1.8V to 3.6V I/O
   
4. Integrated 1.8V and 1.5V Regulators
5. UART to 4M baud
6. SDIO (Bluetooth Type A)/CSPI Interface
7. Deep-Sleep SDIO Operation
8. 7.0mm x 7.0mm x 1.85mm, 0.65mm pitch LGA-28
9. 802.11 Coexistence supported
10. RoHS Compliant
11. BT profile support : SPP, HFP, HSP, OPP, DUN, A2DP, AVRCP, PBAP, MAP, Phonebook download, SMS download, SMS Notification via GSM 07.07 AT commands, Phonebook download via SyncML
12. OS: WinCE, Linux, Android

Features

1. NF8645 Stereo ROM Solution with aptX
   
2. Bluetooth v4.0 specification support
   
3. Radio includes integrated balun and band pass filter
   
4. RF performance of 7dBm transmit power and receiver sensitivity -85dB
   
5. Stereo codec with 2 microphone inputs
   
6. 5-band fully configurable EQ
   
7. Built-in technology for narrowband and wideband voice connections including wind noise reduction
   
8. Wideband speech support by HFP v1.6 profile and mSBC codec
   
9. Voice recognition support for answering calls, enables true hands-free user scenario
   
10. Multipoint HFP connection to 2 phones for voice
    
11. Multipoint A2DP connection enables a headset(A2DP) connection to 2 A2DP source devices for music playback
    
12. Secure simple paring, proximity paring and proximity connection
    
13. Audio interface: I2S and PCM
    
14. Serial interface: UART, USB2.0(full-speed), and SPI
    aptX, SBC, MP3 and AAC decoder support
    
15. Wired audio support(USB and analogue)
    
16. 3 LED outputs
    
17. 4 PIOs
    
18. PIO voltage support from 1.8V to 3.6V
    
19. Integrated 1.35V and 1.8V high-efficiency switch-mode regulators outputs direct form battery or MCU Board
    3.3V linear regulator for USB supply
    
20. Integrated Battery Charger
    
21. Integrated 26M Crystal
    
22. Stamp package dimension: 19.8mm x 14.8mm x 1.7mm
    
23. Operating Voltage: VBUS(+5.0V), VDD_BT3V3(+3.3V), VDD_PADS(+1.8V ~ +3.3V)
    
24. RoHS/ REACH Compliant
    
25. Industry Level
    
26. BT profile support : HFP 1.6 (HD voice ready), A2DP 1.2, AVRCP 1.4

Features

1. Bluetooth v3.0 specification fully qualified software
   
2. Bluetooth v4.0 specification compliant hardware
   
3. Radio includes integrated balun and band pass filter
   
4. RF performance of 8dBm transmit power and -85dBm
   
5. CSR CSR8670 multimedia chip; built-in Bluetooth stack, profiles and DSP Audio/Speech solution
   
6. DSP Co-Processor 16-bit Internal Stereo CODEC 96dB SNR for DAC
   
7. Stereo codec with 2 channels of ADC and up to 6 microphone inputs(includes bias generators and digital microphone support)
   
8. Support narrow-band and wideband voice connections including wind noise reduction
   
9. Audio interface: I2S, PCM and SPDIF
   
10. Low-Power 1.5V Operation, 1.8V to 3.6V I/O
    
11. Integrated 1.35V and 1.8V Linear Regulators
    
12. 3.3V USB pad supply linear regulator
    
13. Switched-Mode Regulator is included
    
14. Integrated Battery Charger
    
15. Serial interface: UART, USB 2.0 full-speed, master and slave bit-serialiser (I2C and SPI)
    
16. Supports up to 16 Mbits on module Flash Memory
    
17. Option support for 64Mb of External SPI Flash
    
18. Multi-configurable I2S, PCM or SPDIF Interface
    
19. Enhanced Audibility, DSP post procession
    
20. Support for up to 6 capacitive touch sensor inputs
    
21. Stamp package dimension: 19.8mm x 14.8mm x 1.7mm
    
22. Operating Voltage: VBUS(+5.0V), VDD_BT3V3(+3.3V), VDD_PADS(+1.8V ~ +3.3V)
    
23. RoHS/ REACH Compliant
    
24. Industry Level
    
25. BT profile support : HFP, HSP, OPP, SPP, DUN, A2DP, AVRCP, PBAP, MAP, Phonebook download, SMS download, SMS Notification via GSM 07.07 AT commands, Phonebook download via SyncML, AEC/NS running in embedded DSP.

Features

1. Fully compatible with Bluetooth v4.0 BLE specification; supported all Bluetooth low energy profiles and host stack which includes ATT, GATT, SMP, L2CAP, GAP
   
2. Bluetooth low energy 6.5dBm High TX output power without an external PA
   
3. Bluetooth low energy -84dBm RX High sensitivity
   
4. <600nA current consumption in dormant mode
   
5. 32kHz and 16MHz crystal, no external clock source needed
   
6. Built in Serial SPI Flash ROM(512Kb)
   
7. Switch-mode power supply
   
8. Programmable general purpose PIO controller
   
9. 3 AIOs (10-bit ADC)
   
10. 7 digital PIOs
    
11. 3 analogue AIOs
    
12. UART
    
13. I2C/SPI for EEPROM/flash memory ICs and peripheral
    
14. 3 PWM modules
    
15. Wake-up interrupt
    
16. Watchdog timer
    
17. LGA package:10.5mm x 10.5mm x 2.3mm
    
18. Operating Voltage : VDD_BT_3V3: 3.3V±10% ; VDD_PADS: 1.8V ~ 3.3V
    
19. RoHS / REACH Compliant

Features

1. Dual-mode Bluetooth/Bluetooth low energy, Classic Bluetooth, v3.0 + HS, v4.0 + BLE
   
2. Wideband speech supported
   
3. Fully qualified Bluetooth v4.0
   
4. Class 1 Bluetooth power levels supported
   
5. High-sensitivity Bluetooth receiver on-chip balun
   
6. Low-power selectable 1.2 to 3.6V I/O
   
7. No external regulators required for USB supply operation
   
8. Full-speed USB2.0 interface
   
9. Integrated I/O and core regulators
   
10. High-speed UART port (up to 4Mbps)
    
11. Two PCM/I2S digital audio interfaces
    
12. Stamp module, 16mm x 16mm x 1.85 mm
    
13. Support for IEEE 802.11 co-existence
    
14. Single antenna needed
    
15. OS: WinCE, Linux, Android
    
16. BT profile support : SPP, HFP, HSP, OPP, DUN, A2DP, AVRCP, PBAP, MAP, Phonebook download, SMS download, SMS Notification via GSM 07.07 AT commands, Phonebook download via SyncML

Features

1. SIP package combo module
2. Dimension: 10mm x 10mm x 1.1mm
3. Operating Voltage : 3.3V±10%
4. RoHS / REACH Compliant
5. Bluetooth 2.1 + EDR
6. Bluetooth 3.0 + HS
7. Bluetooth 4.0 (Bluetooth Low Energy)
8. 65 MHz FM bands (US, Europe, and Japan)
9. IEEE 802.11x Key Features
   
• Single-band 2.4 GHz IEEE 802.11 b/g/n or dual-band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n
  
• Hardware support for virtual simultaneous dual band operation with sub 1ms band switching time
  
• Dual-stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY layer rates up to 300
  
• Mbps for typical upper-layer throughput in excess of 200 Mbps
  
• Supports the IEEE 802.11n STBC (space-time block coding) in both TX and RX for improved range and power efficiency
  
• Contains integrated 2.4 GHz and 5 GHz Power Amplifiers as well as 11 RF control signals available to control external RF switches or LNAs
  
• Supports a single 2.4 GHz antenna shared between WLAN and Bluetooth
  
• Shared Bluetooth and WLAN receive signal path eliminates the need for an external power splitter while maintaining excellent sensitivity for both Bluetooth and WLAN
  Internal fractional nPLL allows support for a wide range of reference clock frequencies
  
• Supports IEEE 802.15.2 external coexistence interface to optimize bandwidth utilization with other
  
• Co-located wireless technologies such as GPS, WiMAX, or UWB
  
• Supports standard SDIO v3.0 (208 MHz, 4-bit and 1-bit), and gSPI (48 MHz) host interfaces
  
• Alternative host interface supports HSIC v1.0 (short-distance USB device)
10. Bluetooth and FM Key Features
• Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for supporting future specifications
  
• Bluetooth Class 1 or Class 2 transmitter operation
  
• Supports extended Synchronous Connections (eSCO) for enhanced voice quality by allowing for retransmission of dropped packets
  
• Adaptive Frequency Hopping (AFH) for reducing radio frequency interference
  
• Interface support — Host Controller Interface (HCI) using a high-speed UART interface and
• PCM for audio data
  
• FM unit supports HCI for communication
  
• Low power consumption improves battery life of handheld devices
  
• FM receiver: 65 MHz to 108 MHz FM bands; supports the European Radio Data Systems (RDS) and the North American Radio Broadcast Data System (RBDS) standards
11. Security
• WPA™ and WPA2™ (Personal) support for powerful encryption and authentication
  
• AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility
  
• Reference WLAN subsystem provides Cisco® Compatible Extensions (CCX, CCX 2.0, CCX 3.0, CCX 4.0, CCX 5.0)
  
• Reference WLAN subsystem provides Wi-Fi Protected Setup (WPS)
  
• Worldwide regulatory support: Global products supported with worldwide homologated design

Features

1. Single-band 2.4 GHz 802.11 n compliant.
2. 2.4GHz internal PA.
3. Integrated crystal.
4. Internal TX/RT and RX diversity switches.
5. Support MCS0-7 coding rates.
6. Short Guard Interval (SGI) supported.
7. Greenfield, mixed mode, and legacy mode supported.
8. 802.11n MPDU/MSDU aggregation support for high throughput.
9. Full 802.11 b/g legacy compatibility with enhance performance.
10. Single stream IEEE 802.11n support for 20MHz and 40MHz channel provides PHY layer rates up to150Mbps for typical upper-layers throughput in excess of 90Mbps.
    
11. Supports the IEEE 802.11n RX space-time block coding (STBC) and low-density parity check (LDPC) options for improved range and power efficiency.
    
12. Supports an IEEE.15.2 external coexistence interface to optimize bandwidth utilization with other collocated wireless technologies such as GPS, WiMAX, LTE, Bluetooth and UWB.
    
13. Supports USB2.0, standard SDIO v2.0 (50MHz, 4 bit and 1 bit) host interfaces.
    
14. Supports I2S audio interface.
    

Features

1. Contactless transmission of data and supply energy (no battery needed)
   
2. Operating distance: up to 2 cm
   
3. Operating frequency: 13.56 MHz
   
4. Fast data transfer: 106 Kbit/s
   
5. High data integrity: 16-bit CRC, parity, bit coding, bit counting
   
6. True anti-collision
   
7. 7 byte serial number (cascade level 2 according to ISO/IEC 14443-3)
   
8. Data retention at minimum of 5 years
   
9. Write endurance 10000 cycles
   

Features

1. WLAN, Bluetooth on a module
2. WLAN / Bluetooth frontend module for industry / automotive / portable applications
3. Supporting IEEE 802.11 a/b/g/n (WLAN) at 2.4/5 GHz, Bluetooth frequency band at 2.4 GHz
4. Integrated high-rejection filter for Coexistence between WLAN and Bluetooth radios. (bandwidth sharing)
5. Integrated high-isolation 2.4/5G Diplexer for WLAN
6. Integrated high-isolation 2.4G Bluetooth RF Path
7. Integrated WLAN and Bluetooth Baluns
8. WLAN 2.4/5 GHz SISO(20/40MHz channels), 2.4GHz SISO(20MHz channels)
9. Bluetooth BT4.0,BLE,ANT and all audio processing feature work in parallel and include full coexistence with WLAN
10. Integrated high-output Efficient Power Amplifier and LNA
11. Integrated low noise LDO for Bluetooth and WLAN voltage supply (3.3V/1.8V input)
12. Embedded internal clocks
13. Zero external components required
14. Seamless integration with TI OMAP/AM335X application processor
15. Direct connection to battery using external switching mode power supply supporting from 3.3V to 5.5V operatin
16. VIO in the 1.8V domain
17. Sleep Current: 160uA(Leakage, Firmware retained)
18. WLAN 2.4GHz SISO Throughput(MCS7): 55Mbps (UDP TX) ; 45Mbps (UDP RX)
19. WLAN 5GHz(HT40) Throughput(MCS7): 110Mbps (UDP TX ; 65Mbps (UDP RX)
20. Stamp module suitable for Surface Mounted Technology (SMT)
21. Stamp-56 package
22. Dimension 17mm(L) x 17mm(W) x 1.8mm(H)
23. Operating Voltage : VBAT : 3.0 to 4.3V ; VDD_IO_1V8: 1.62 to1.95V
24. RoHS / REACH Compliant
25. Industrial Level

WLAN Features

1. WLAN MAC Baseband Processor which is IEEE802.11 a/b/g and IEEE802.11n date rates with 20 or 40MHz SISO and 20MHz MIMO(MCS7 with SGI)
2. Fully calibrated system. No production calibration required
3. Optimized for ultra low current consumption in all operating modes including extremely low power modes
4. New advanced co-existence scheme with BT/BLE/ANT
5. IEEE Std 802.11d,e,h,i,k,r,s PICS compliant
6. Supports Cisco Client eXtensions (CCX)standard
7. Supports serial debug interface
8. Supports Secure Digital Input/Output(SDIO) Serial Peripheral Interface(SPI) Host Interface for BT
9. Medium-Access Controller(MAC)
   
   － Embedded ARM Central Processing Unit(CPU)
   
   － Hardware-Based Encryption/Decryption Using 64-,128- and 256-bit WEP,TKIP or AES Keys
   
   － Supports requirements for Wireless Fidelity(Wi-Fi) Protected Access(WPA and WPA2.) and IEEE Std 802.11i[Includes      Hardware-Accelerated Advanced-Encryption Standard(AES)]
   
   － Designed to Work With IEEE Std 802.1x for Virtual Private Network(VPN)Solutions
   
10. Baseband Processor
    
    － IEEE Std 802.11n single-stream data rates(MCS0-7) and SGI support
    
11. 2.4GHz Radio
    
    － Internal LNA and PA
    
    － Supports : IEEE Std 802.11a, 802.11b,802.11g and 802.11n
    

Bluetooth Features

1. Bluetooth 1.1, 1.2, 2.0+EDR and 2.1+EDR 3.0 and 4.0 specification compliant – up to HCI level
2. Bluetooth 2.4GHz systems including BT Enhanced Data Rate (2 and 3 Mbps)
3. Enhanced host interfaces(UART, btSPI)
4. Very low power consumption
5. On-chip Embedded radio
   
   － Integrated 2.4GHz RF transceiver
   
   － All digital PLL transmitter with digitally controlled oscillator
   
   － Near zero IF architecture
   
   － On-chip TX/RX switch
   
   － Supports for Class-1.5 applications
   
6. Embedded ARM Microprocessor System
   
   － High rate four wire UART HCI(H4)
   
   － Automatic clock-detection mechanism
   
7. Flexible PCM and I2S interfaces: full flexibility for data order, sampling and positioning
8. Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the entire temperature range
9. TI-priority low-power scan achieves paging and inquiry scans at 1/3 normal power
10. Digital Radio Processor(DRP) single-ended 50Ω I/O for easy RF interfacing
11. Patch trap mechanism and reserved RAM enables easy bug fixes
12. Advance Audio Interfaces and capabilities
    
    － A2DP support
    
    － A2DP internal loopback
    
    － Wide-Band Speech support
    
    － On board SBC encoder/decoder – offloads host for A2DP and Wide-Band speech processing
    
    － Full support for Bluetooth low energy(BLE) standard. BLE can operate in parallel with standard Bluetooth function
    

BLE Features

1. TI BLE solution optimized for the proximity/sports use-case
2. Support large number of multiple connections(up to 10)
3. Multiple sniff instances are tightly coupled to achieve minimum power consumption
4. Independent buffering for LE allows having large number of multiple connections without affecting BR/EDR performance
5. Includes built-in coexistence and prioritization handling for BT,BLE and WLAN

Features

1. WLAN, Bluetooth on a module
2. WLAN / Bluetooth frontend module for industry / automotive / portable applications
3. Supporting IEEE 802.11 a/b/g/n (WLAN) at 2.4/5 GHz, Bluetooth frequency band at 2.4 GHz
4. Integrated high-rejection filter for Coexistence between WLAN and Bluetooth radios. (bandwidth sharing)
5. Integrated high-isolation 2.4/5G Diplexer for WLAN
6. Integrated high-isolation 2.4G Bluetooth RF Path
7. Integrated high-isolation GNSS RF Path
8. WLAN 2.4/5 GHz SISO(20/40MHz channels), 2.4GHz SISO(20MHz channels)
9. Bluetooth BT4.0,BLE,ANT and all audio processing feature work in parallel and include full coexistence with WLAN
10. Integrated high-output Efficient Power Amplifier and LNA.
11. Integrated low noise LDO for Bluetooth and WLAN voltage supply (3.3V/1.8V input)
12. Embedded internal clocks
13. Zero external components required
14. Seamless integration with TI OMAP/AM335X application processor
15. Direct connection to battery using external switching mode power supply supporting from 3.3V to 5.5V operating
16. VIO in the 1.8V domain
17. On-chip position engine
18. Simultaneous processing of GPS,GLONASS,QZSS and SBAS satellite systems
19. Support for up to 36 acquisition channels
20. Operation through Bluetooth host interfaces(shared transport)
21. TTFF and accuracy improvements to meet cellular operators’ indoor performance requirements
22. Stamp module suitable for Surface Mounted Technology (SMT)
23. Stamp-56 package
24. Dimension 17mm(L) x 17mm(W) x 1.8mm(H)
25. Operating Voltage : VBAT : 3.0 to 4.3V ; VDD_IO_1V8: 1.62 to1.95V
26. RoHS / REACH Compliant
27. Industrial Level

Features

1. WLAN, Bluetooth on a module
2. WLAN / Bluetooth frontend module for industry / automotive / portable applications
3. Supporting IEEE 802.11 a/b/g/n (WLAN) at 2.4/5 GHz, Bluetooth frequency band at 2.4 GHz
4. Integrated high-rejection filter for Coexistence between WLAN and Bluetooth radios. (bandwidth sharing)
5. Integrated high-isolation 2.4/5G Diplexer for WLAN
6. Integrated high-isolation 2.4G Bluetooth RF Path
7. Integrated high-isolation GNSS RF Path
8. Integrated WLAN and Bluetooth Baluns
9. WLAN 2.4/5 GHz SISO(20/40MHz channels), 2.4GHz MIMO(20MHz channels)
10. Bluetooth BT4.0,BLE,ANT and all audio processing feature work in parallel and include full coexistence with WLAN
11. Integrated high-output Efficient Power Amplifier and LNA
12. Integrated low noise LDO for Bluetooth and WLAN voltage supply (3.3V/1.8V input)
13. Embedded internal clocks
14. Zero external components required
15. Seamless integration with TI OMAP/AM335X application processor
16. Direct connection to battery using external switching mode power supply supporting from 3.3V to 5.5V operating
17. VIO in the 1.8V domain
18. On-chip position engine
19. Simultaneous processing of GPS,GLONASS,QZSS and SBAS satellite systems
20. Support for up to 36 acquisition channels
21. Operation through Bluetooth host interfaces(shared transport)
22. TTFF and accuracy improvements to meet cellular operators’ indoor performance requirements
23. Stamp module suitable for Surface Mounted Technology (SMT)
24. Stamp-56 package
25. Dimension 17mm(L) x 17mm(W) x 1.8mm(H)
26. Operating Voltage : VBAT : 3.0 to 4.3V ; VDD_IO_1V8: 1.62 to1.95V
27. RoHS / REACH Compliant
28. Industrial Level